秒速赛车冷热号统计
Connects outer layer with inner layer; exposed only on one side of the board.
秒速赛车走势
Connect internal layers without being exposed on either surface.秒速赛车规则
Integrated circuits glued and wire-bonded to boards (foregoing packaging) culminating in a Chip with fine wires bonded to both it and landing pads.秒速赛车开奖规律
For purpose of controlling deposition, a mask is applied through use of photographic imaging techniques.秒速赛车开奖查询
Copper layer connected to the ground that covers most of the board layer it inhabits.秒速赛车最快开奖
Surface adhesive substance spread for bonding or coating, this material (most commonly FR-4) is non-conductive carrier of copper traces.秒速赛车全天两期计划
Also known as Final Finish, it is selected by the customer. The Assembly component process determines plating for the top and bottom layers. The different surface finishing processes are ENEPIG, ENIG, HASL, Pb-free HASL, OSP, Immersion gold, Immersion silver, and Deep Gold. Various factors considered during selection process include application and shelf life.秒速赛车大小玩法
Copper strip used for carrying signal between two points on a circuit board.