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Newer production technologies including laser and tight tolerance controlled depth mechanical drilling, Direct Imaging, and via fill chemistries allow for the creation of any layer vias. These are created one layer set at a time by pressing, drilling, plating, and etching layers to a base layer set. Since the designer is no longer restricted to routing around vias that extend multiple layers through the board, size formats can be reduced dramatically to increase function per square measure of area. Any-Layer Vias are also known as Every Layer Interconnect (ELIC).